Next-Generation Thermal Architectures: High-Density and AI-Ready Data Center Cooling

Next-Generation Thermal Architectures: High-Density and AI-Ready Data Center Cooling

August 24, 2026 · 22 min · Episode 1098

About this episode

The episode discusses data center cooling and AI-ready infrastructure with experts from PLC Group.

People in this episode

Host: Kripa Anand

Guests: Jacques Morvan, Sean Corcoran

Sponsors

UPS, ADP Canada

Mentioned in this episode

Organizations: PLC Group

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