Automated Multiphysics for 3D IC Success
From EE Times Current by EE Times On Air
March 6, 2026 · 29 min
About this episode
The episode discusses the challenges and solutions in achieving successful 3D IC design, particularly focusing on power management and the impact of heat on transistor behavior.
Challenges: power generates heat. Heat distorts wires and changes transistor behavior. A change in wires and transistors implies that initial power estimates were wrong. More and more designers are moving to heterogeneous architectures. This comes with new challenges as compared to the 2D domain. Come learn how the Calibre team can help achieve successful 3D IC design goals.
Topics covered
- 3D IC design
- multiphysics
- heterogeneous architectures
- power management
- transistor behavior
Keywords
- 3D IC
- multiphysics
- heat distortion
- transistor behavior
- heterogeneous architectures
Mentioned in this episode
Organizations: Calibre
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