PCB Chat

This is part two of a two-part series.In Part One, we explored how the electronics industry transitioned from a clean-everything approach to one where cleaning became optional. But what happens when the assumptions behind “no-clean” collide with modern electronics design?In this episode of Reliability Matters, Mike Konrad examines how the definition of cleanliness has fundamentally changed.As assemblies became smaller, denser, and increasingly deployed into harsh environments, the industry discovered that historical cleanliness standards were no longer sufficient to predict real-world reliability. Modern low stand-off components like QFNs, BGAs, and CSPs create tight geometries where residues can become trapped and difficult to remove, while thermal cycling and internal condensation can create localized harsh environments inside the product itself.This episode explores:• Why IPC moved away from fixed cleanliness limits• The growing importance of SIR and ROSE testing• Why “cleanliness” is now tied to risk, not a number• How internal condensation can trigger electrochemical migration• Why no-clean flux has become the most commonly cleaned flux type in the industry• The return of cleaning as a mainstream reliability process• Why modern assemblies require aggressive spray-in-air cleaning technologies instead of historical immersion-based vapor degreasing methods• How diffused spray patterns improve cleaning beneath low stand-off componentsKonrad also explains how modern cleaning challenges are no longer just about chemistry. They are about physics, fluid delivery, and whether the cleaning process can physically reach contamination hidden beneath today’s densely packed components.As electronics continue to shrink and reliability expectations continue to rise, one question becomes increasingly important: Clean enough for what?If you work in electronics manufacturing, reliability engineering, process engineering, or quality assurance, this episode provides a detailed look at why post-reflow cleaning has once again become a critical part of modern electronics manufacturing.

Mike Konrad continues a dive into the world of contract manufacturing—a vital piece of the electronics ecosystem.Joining him are two industry leaders who know this space inside and out. First, we have Daniel Stanphill, SMT process engineer at Aurora Boardworks, and alongside him, Sean Kincaid, president of K & F Electronics. Both companies provide contract manufacturing services to a wide range of customers, helping turn design concepts into dependable, production-ready circuit assemblies.In this conversation, we’ll explore what makes for a successful relationship between contract manufacturers and their customers. We’ll talk about the types of customers they look for, the challenges they face in today’s manufacturing environment, and the common mistakes that can derail a project if not addressed early on. Most importantly, we’ll dig into best practices that can help customers and manufacturers work together more effectively.

Note: This is the fourth of four episodes on the subject of soldering materials. Today, we're diving into a topic that's reshaping how we think about thermal management, energy efficiency, and long-term performance in electronics manufacturing—low temperature soldering. Joining Mike Konrad is Dr. HongWen Zhang, principal metallurgist and R&D manager of the Alloy Group at Indium Corporation. Dr. Zhang is not only a seasoned materials scientist with a Ph.D. in materials science and engineering, a master’s in materials science and engineering and in mechanical engineering and a bachelor’s in metallurgical physical chemistry he’s also coinventor of Durafuse, a family of solder alloys that are redefining what's possible at low reflow temperatures—which, reportedly, does not compromise reliability. In this episode, we’ll explore how low temperature solders are helping manufacturers lower energy consumption, protect heat-sensitive components, and still meet the rigorous mechanical and environmental demands of today’s electronics—from wearables to wafer-level packaging. We’ll also talk about the challenges of brittleness, drop shock resistance, activation and encapsulation of no clean activators, and how cutting-edge materials research is solving problems that used to be considered trade-offs. Whether you’re a reliability engineer, a process expert, or just solder-curious, this episode is packed with insights you won’t want to miss.

This is the third of four episodes on the subject of soldering materials. Today, we’re continuing our deep dive into the world of soldering materials, from advanced alloys and flux chemistries to global manufacturing strategy and materials innovation, with one of the industry’s most respected leaders. Joining Mike Konrad is Ross Berntson, president and CEO of Indium Corp. Berntson has been with Indium for nearly 30 years, starting as a product specialist and rising through the ranks with leadership roles in product management, technical support, and international operations. He even spent time leading Indium’s Asia Holdings while based in Singapore, strengthening the company’s presence across Southeast Asia. In his current role as CEO, Berntson sets the strategic direction for a global materials powerhouse, one that’s known not only for its high-performance soldering products but for its commitment to innovation, collaboration, and engineering support through the company’s “One Engineer to Another” philosophy. Berntson holds degrees in chemistry, teaching and an MBA from Cornell University, where he earned several prestigious academic awards. He’s also deeply engaged in both the electronics industry and his community, serving on multiple boards and leading with a strong emphasis on culture, opportunity, and respect, the core of what Indium calls “The Indium Way.” In this episode, we’ll discuss how soldering materials are evolving to meet the demands of modern electronics, from miniaturization and harsh environments to UHDI and advanced packaging. We’ll also talk about Indium’s unique positioning in the industry, the challenges of global supply chains, and what the future of soldering looks like from the vantage point of a company that’s helped shape it.

In this episode, Mike Konrad is joined by Chris Ward, founder and managing director of Solderking Assembly Materials, a UK-based manufacturer of solders and chemical consumables for electronic, electrical, and engineered assemblies.Ward brings decades of experience in soldering materials and chemical formulations—and he’s built a company committed to performance, consistency, and innovation.Earlier this year, Ward and his company were honored with the prestigious King’s Award for Enterprise in International Trade, recognizing their exceptional export growth. That recognition earned him an invitation to Windsor Castle, where he had the distinct honor of meeting King Charles III.Today, we’ll explore the evolving world of soldering materials—from the realities behind “no-clean” flux, to reliability challenges in harsh environments, to innovations in solder chemistry that support today’s miniaturized and mission-critical electronics.Whether you're on the production floor, in the design lab, or managing quality and reliability, this is a conversation that brings valuable insight into the materials behind the mission.